qcs8155_firmware

Memory corruption due to double free in core while initializing the encryption key.

Memory corruption in TZ Secure OS while requesting a memory allocation from TA region.

Memory corruption when allocating and accessing an entry in an SMEM partition continuously.

Memory corruption in graphics due to use-after-free while importing graphics buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

Possible use after free due to lack of null check of DRM file status after file structure is freed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables

Memory corruption in Graphics while importing a file.

Memory corruption while Configuring the SMR/S2CR register in Bypass mode.

Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Memory Corruption in Core due to secure memory access by user while loading modem image.

Memory corruption due to double free in Core while mapping HLOS address to the list.

Memory Corruption in HLOS while registering for key provisioning notify.

Possible unauthorized access to secure space due to improper check of data allowed while flashing the no access control device configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

Memory corruption due to stack-based buffer overflow in Core

Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

Memory corruption in graphics due to buffer overflow while validating the user address in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region.

Memory corruption when there is failed unmap operation in GPU.

Memory corruption in core due to stack-based buffer overflow